Electronic components

CXMT considers second DRAM fab in Beijing

CXMT considers second DRAM fab in Beijing

August 4, 2026

TSMC restores normal production at JASM Kumamoto fab after earthquake

TSMC restores normal production at JASM Kumamoto fab after earthquake

August 4, 2026

NXP reportedly in talks to acquire edge AI chipmaker Ambarella

NXP reportedly in talks to acquire edge AI chipmaker Ambarella

August 3, 2026

Allegro launches A81415 safety PMIC with integrated wheel-speed interface

Allegro launches A81415 safety PMIC with integrated wheel-speed interface

August 3, 2026

Holtek to raise MCU prices by 10% to 20% across all product lines

Holtek to raise MCU prices by 10% to 20% across all product lines

August 3, 2026

Sony to restart Kumamoto image sensor production in stages from August 4

Sony to restart Kumamoto image sensor production in stages from August 4

July 31, 2026

U.S. signs $874 million CHIPS R&D LOIs with seven semiconductor companies

U.S. signs $874 million CHIPS R&D LOIs with seven semiconductor companies

July 31, 2026

ASE raises 2026 capex to $10.5 billion as advanced packaging demand accelerates

ASE raises 2026 capex to $10.5 billion as advanced packaging demand accelerates

July 31, 2026

Kumamoto earthquake halts semiconductor and automotive factories

Kumamoto earthquake halts semiconductor and automotive factories

July 30, 2026

UMC raises 2026 capex to $2 billion and expands Singapore and Tainan fabs

UMC raises 2026 capex to $2 billion and expands Singapore and Tainan fabs

July 30, 2026