MarketWatch

Foxconn, Radiall and Thales form Tessalia to advance system-in-package production

Foxconn, Radiall and Thales form Tessalia to advance system-in-package production

June 2, 2026
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TSMC adopts Nvidia AI and accelerated computing to optimize advanced chip manufacturing

TSMC adopts Nvidia AI and accelerated computing to optimize advanced chip manufacturing

June 2, 2026
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VIS sees stronger second-half demand as foundry capacity remains fully utilized

VIS sees stronger second-half demand as foundry capacity remains fully utilized

June 1, 2026
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TSMC may raise 3nm prices as AI chip demand strains advanced foundry capacity

TSMC may raise 3nm prices as AI chip demand strains advanced foundry capacity

June 1, 2026
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ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
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ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
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PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
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Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
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GlobalWafers plans silicon wafer price increases as AI and automotive demand recover

GlobalWafers plans silicon wafer price increases as AI and automotive demand recover

May 28, 2026
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Infineon issues price increase notice amid rising semiconductor costs

Infineon issues price increase notice amid rising semiconductor costs

May 27, 2026
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