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SIA: Global semiconductor sales increased 18.3% year-on-year in the second quarter
SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024
onsemi expects to produce 200mm SiC wafers by 2025
AMD expects AI chip supply to be tight until 2025
Rapidus to build fully automated 2nm chip fab, promising 66% faster delivery
MarketWatch
Micron forms new cloud storage unit to target AI data centers and HBM growth
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Tenstorrent to expand Japan engineering team sixfold amid chip design push
Manufacturer
Nexperia launches flip-chip ESD diodes for high-speed automotive interfaces
Manufacturer
Vishay releases 600 V standard and 60 V–200 V TMBS® rectifiers in DFN33A package with up to 9 A current rating
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Yageo raises bid for Shibaura, intensifying takeover battle with MinebeaMitsumi
MarketWatch
onsemi withdraws Allegro acquisition bid, shifts focus to core semiconductor growth
MarketWatch
TSMC to relocate 30% of advanced chip capacity to Arizona fab
MarketWatch
SK Hynix to expand HBM production with record investment of over $13.7 billion
MarketWatch
Melexis to localize end-to-end chip manufacturing in China by 2026
Manufacturer
TI launches lidar, clock, and radar chips to boost ADAS performance and vehicle autonomy
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