SIA: Global semiconductor sales increased 18.3% year-on-year in the second quarter

SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024

onsemi expects to produce 200mm SiC wafers by 2025

AMD expects AI chip supply to be tight until 2025

Rapidus to build fully automated 2nm chip fab, promising 66% faster delivery

SemiMedia - Electronic Component Industry News & Insights

Applied Materials opens $500 million Singapore campus to expand chip equipment manufacturing
MarketWatch

Applied Materials opens $500 million Singapore campus to expand chip equipment manufacturing

June 11, 2026
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TSMC says price increases remain possible as inflation raises operating costs
MarketWatch

TSMC says price increases remain possible as inflation raises operating costs

June 11, 2026
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Global chip equipment spending hits record $36.55 billion in Q1 as AI investment grows
MarketWatch

Global chip equipment spending hits record $36.55 billion in Q1 as AI investment grows

June 11, 2026
0
Wall Street expects DRAM and NAND shortages to last through 2028
MarketWatch

Wall Street expects DRAM and NAND shortages to last through 2028

June 10, 2026
0
KYOCERA AVX expands TransGuard VT MLV series for 48V automotive power systems
Manufacturer

KYOCERA AVX expands TransGuard VT MLV series for 48V automotive power systems

June 10, 2026
0
onsemi to cut 200-300 jobs at Czech SiC wafer facility amid market adjustments
MarketWatch

onsemi to cut 200-300 jobs at Czech SiC wafer facility amid market adjustments

June 10, 2026
0
Nexperia announces collaboration with Polar Semiconductor to expand next-generation power MOSFET production
Manufacturer

Nexperia announces collaboration with Polar Semiconductor to expand next-generation power MOSFET production

June 9, 2026
0
Middle East conflict disrupts PCB resin supply, raising electronics cost risks
MarketWatch

Middle East conflict disrupts PCB resin supply, raising electronics cost risks

June 9, 2026
0
ROHM launches TSC3PAK package for SiC MOSFETs enhancing heat dissipation and reliability
Manufacturer

ROHM launches TSC3PAK package for SiC MOSFETs enhancing heat dissipation and reliability

June 9, 2026
0
Nvidia and SK hynix expand partnership to develop next-generation memory for AI factories
MarketWatch

Nvidia and SK hynix expand partnership to develop next-generation memory for AI factories

June 8, 2026
0

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