electronic components news

TSMC may raise 3nm prices as AI chip demand strains advanced foundry capacity
MarketWatch

TSMC may raise 3nm prices as AI chip demand strains advanced foundry capacity

June 1, 2026
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ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips
MarketWatch

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
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ST issues new price increase notice effective June 28
MarketWatch

ST issues new price increase notice effective June 28

May 29, 2026
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PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production
MarketWatch

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
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Samsung to invest $1.5 billion in Vietnam for first chip testing facility
MarketWatch

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
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GlobalWafers plans silicon wafer price increases as AI and automotive demand recover
MarketWatch

GlobalWafers plans silicon wafer price increases as AI and automotive demand recover

May 28, 2026
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ST launches 700V PowerGaN devices for high-efficiency power applications
Manufacturer

ST launches 700V PowerGaN devices for high-efficiency power applications

May 28, 2026
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Infineon issues price increase notice amid rising semiconductor costs
MarketWatch

Infineon issues price increase notice amid rising semiconductor costs

May 27, 2026
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Vishay expands IHXL high-current inductors for automotive and renewable power systems
Manufacturer

Vishay expands IHXL high-current inductors for automotive and renewable power systems

May 27, 2026
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ROHM launches ultra-low capacitance ESD diodes for high-speed AI and automotive interfaces
Manufacturer

ROHM launches ultra-low capacitance ESD diodes for high-speed AI and automotive interfaces

May 26, 2026
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