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Global 300mm fab equipment spending set to rise, AI drives semiconductor investment
Murata completes new MLCC production facility in Izumo, Japan
TSMC plans GigaFab cluster in Arizona, aiming for capacity close to Taiwan
TSMC to bring 3nm production to second Japan fab by 2028
MGC raises semiconductor materials prices 30% as packaging material costs rise
DRAM pauses after rally as NAND extends gains, Q2 rebound expected
Fujitsu, Rapidus team up on 1.4nm AI chip for servers
South Korea sees helium supply stable through June despite concerns
Apple expands U.S. chip supply chain with new partner investments
Kioxia to phase out older NAND flash products
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