July 7, 2026 /SemiMedia/ — Broadcom has agreed to extend its chip partnership with Apple through 2031, Reuters reported, expanding a long-term agreement covering the development and supply of multiple custom semiconductor components.

The extension builds on years of supply cooperation between the two companies. Apple has long been one of Broadcom’s largest customers and is widely believed to account for about 20% of Broadcom’s annual revenue.

Although Apple has continued to develop more chips internally, including its C1 and C1X cellular modem chips, Broadcom remains an important supplier of wireless connectivity and radio-frequency components used across Apple’s product portfolio.

These products include custom RF components, Wi-Fi and Bluetooth connectivity chips, and other networking semiconductors used in Apple devices. They are important for wireless communication and networking functions in products such as the iPhone, iPad and Mac.

In 2023, Apple and Broadcom signed a multibillion-dollar agreement covering 5G RF components manufactured in the United States. The extension of the partnership through 2031 is viewed as a further strengthening of that arrangement and of Apple’s long-term sourcing relationship with Broadcom.

Industry analysts said Apple’s internal chip development does not mean the company will fully move away from key external semiconductor suppliers. RF, wireless connectivity and networking components require long qualification cycles and complex system integration, making supplier continuity important.

For Broadcom, the extended Apple agreement is strategically meaningful. While its AI chip and networking businesses are growing rapidly, Apple-related revenue remains an important part of its consumer semiconductor business.

The agreement also reflects a broader balance in Apple’s semiconductor strategy. The company is expected to continue expanding internal chip design, but external suppliers are still likely to remain important in areas such as RF front-end components, wireless connectivity and high-performance networking chips.