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Vishay launches fast-acting thin film chip fuses for circuit protection
ROHM rolls out low-power DC motor driver ICs for appliance and industrial uses
Infineon deepens 750V SiC push as packaging targets higher power density
TDK launches vibration-resistant hybrid polymer capacitors for automotive and industrial use
Renesas launches RA6W Wi-Fi 6 MCUs and modules for low-power IoT applications
Taiyo Yuden begins mass production of embeddable 100-μF MLCC for AI server power lines
TSMC speeds up U.S. advanced packaging plans as CoWoS demand surges
ROHM launches TOLL-package SiC MOSFETs to boost thermal performance and power density
Vishay launches new 1200 V SiC power modules for automotive and energy systems
ROHM launches high-speed RPR-0730 optical sensor for industrial and printing systems
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