September 14, 2026 / SemiMedia / — Combined revenue of the world's top 10 fabless IC design companies rose 73% year over year to more than $141.45 billion in the second quarter of 2026 as expanding AI applications drove demand for GPUs, CPUs, ASICs and interconnect products, according to TrendForce.

NVIDIA remained firmly in first place, with second-quarter revenue rising 99% year over year to nearly $91.16 billion. Its share of the top 10 companies' combined revenue increased to 64%, supported by hyperscale cloud providers, Neo Cloud operators, sovereign AI projects and enterprise customers.

Broadcom ranked second with revenue of more than $18.89 billion, up 112% year over year. OpenAI's first custom ASIC and Google's TPU 8i began shipping during the quarter, while growing XPU deployments also increased demand for networking and interconnect products. TrendForce expects six major custom silicon customers, including Anthropic and OpenAI, to continue supporting Broadcom's XPU business.

AMD moved into third place with revenue exceeding $11.53 billion. The growing adoption of agentic AI has increased the importance of CPUs in AI infrastructure, while AMD's data center CPU business has posted record revenue for five consecutive quarters as the company continues to gain share in the x86 server market.

Qualcomm slipped to fourth place as weakness in the smartphone market limited growth, highlighting the increasing concentration of fabless industry expansion around AI computing and data center products.

OmniVision Group ranked tenth with semiconductor design revenue of approximately $838 million. While its smartphone and automotive CIS businesses faced pressure from higher memory and device costs, demand from emerging applications such as action cameras remained strong. The company is also expanding into optical communications EICs, including TIAs and drivers.

TrendForce's latest figures show that AI infrastructure continues to widen the growth gap across the fabless sector, with suppliers exposed to GPUs, server CPUs, custom ASICs and high-speed interconnects capturing most of the industry's current expansion.