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Semiconductor supply chain strained by US 50% copper duty
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ROHM unveils ultra-compact 30V MOSFET with industry-low ON-resistance for fast charging devices
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US mulls AI chip export controls targeting Malaysia and Thailand
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OSAT firm Aptos files for bankruptcy amid prolonged losses
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Chinese OSAT players gain momentum as global packaging market grows 3% in 2024
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Foxconn weighs $3 billion bid for Singapore chip packaging firm UTAC
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Top 10 OSAT vendors post modest growth in 2024 amid rising demand for advanced packaging
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Wise Road Capital considers $3 billion sale of semiconductor packaging firm UTAC
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