June 2, 2026 /SemiMedia/ — Foxconn, Radiall and Thales have jointly launched Tessalia Technology SAS, a new joint venture dedicated to semiconductor assembly and testing (OSAT), with plans to produce over 50 million system-in-package (SiP) units annually by 2033.

The joint venture will leverage the partners’ expertise in advanced packaging, testing and assembly, using innovative technologies to develop ultra-high-density packaging solutions. These solutions are designed to simplify PCB layouts, produce smaller and lighter components, and improve integration and yield, representing a significant advance in high-end semiconductor packaging.

Tessalia aims to become a competitive European semiconductor packaging company with technological autonomy, addressing regional strategic industry requirements. Through licensing agreements, Tessalia will access Foxconn technology and offer customers a single-window service covering the full process from package design to assembly and testing. This vertically integrated model is expected to streamline production and shorten lead times.

Production is slated to begin by the end of 2029, with the goal of achieving over 50 million SiP units per year by 2033. The joint venture also plans to attract additional industry partners to support a projected investment exceeding €250 million through 2033.