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Amkor reportedly considers sale of stake in China business

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August 11, 2026

August 11, 2026 / SemiMedia / — Amkor Technology is reportedly evaluating several options for its China operations, including the potential sale of an equity stake in the business.

People familiar with the matter said the US-based semiconductor packaging and testing provider has appointed advisers to prepare for a possible separation and assess interest from prospective buyers.

Amkor could retain a minority interest following a transaction, while the China business may be valued at between $1 billion and $1.5 billion. Potential buyers are expected to include Asian investment firms and semiconductor industry participants.

The discussions remain at an early stage, and no final decision has been made. The valuation, ownership structure and other transaction terms could still change. Amkor declined to comment on the report.

Amkor established its first semiconductor packaging and testing facility in Shanghai in 2001. The company expanded its local manufacturing presence in 2004 by acquiring a large IBM chip facility in the city.

The reported review comes as Amkor increases its investment in the North American AI semiconductor supply chain and advanced-packaging market.

In July, Amkor announced a $1.5 billion multiyear strategic agreement with Nvidia to jointly develop advanced packaging and testing technologies for next-generation AI and accelerated-computing platforms.

One month earlier, Amkor entered into a long-term partnership with TSMC to support advanced packaging and testing for semiconductor production in Arizona.

The developments indicate that Amkor may be rebalancing its regional operations while directing additional resources toward US-based AI chip manufacturing and advanced packaging.

Chinese outsourced semiconductor assembly and test providers are also expanding their production capacity and technical capabilities. Companies including JCET, Tongfu Microelectronics and Huatian Technology are increasing their presence in conventional packaging while investing in Chiplet integration, 2.5D and 3D packaging, HBM-related packaging and other advanced technologies.

Amkor has not made a final decision regarding its China operations. Any formal transaction would depend on buyer interest, valuation and the ownership structure selected by the company.

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Advanced packaging AI chips Amkor Technology China semiconductor industry Electronic components Nvidia OSAT semiconductor packaging Semiconductor testing TSMC
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