October 14, 2025 /SemiMedia/ — Amkor Technology announced a $7 billion investment to build an advanced semiconductor packaging and testing campus in Arizona, expanding its earlier investment plans and strengthening U.S. capabilities in chip assembly and testing.

The new facility will include a second manufacturing plant and additional cleanroom space, positioning it among the largest backend semiconductor manufacturing investments in the United States. Once completed, the site is expected to create up to 3,000 high-quality jobs and serve as a cornerstone in reshoring advanced packaging capacity from Asia back to the U.S.

Located within Arizona’s rapidly growing high-tech corridor, the Amkor campus will be the first large-scale advanced packaging and testing facility in the country. The company expects to complete construction of the first building by mid-2027, with production starting in early 2028. The site will feature smart factory technology, scalable production lines and multiple advanced packaging processes designed to support major clients such as Apple and NVIDIA.

“This groundbreaking marks a major step in Amkor’s long-term strategy for growth and innovation,” said Giel Rutten, president and chief executive officer of Amkor Technology. “We are building a facility that will meet the most advanced needs of our customers and help define the future of semiconductor manufacturing in the United States.”

The project is supported by the U.S. CHIPS Act, advanced manufacturing tax credits, and various state and local incentives. Across two phases, the site will include more than 750,000 square feet of cleanroom space and will complement TSMC’s wafer fab in Peoria, creating a complete end-to-end semiconductor manufacturing ecosystem in Arizona.