March 23, 2026 /SemiMedia/ — Kioxia said in a notice sent to customers that it will discontinue its TSOP-packaged NAND flash products, as part of a broader shift in packaging and demand.

The company said the move is linked to the end of life of related substrates, changes in market demand, and limits in production capacity. TSOP packages have become less common as the industry moves to higher-density and more compact formats.

Kioxia outlined a timeline for the phase-out, with the last forecast submissions due by May 30, 2026, final orders accepted until September 15, 2026, and last shipments planned for March 15, 2027.

Industry sources say older NAND formats using TSOP packaging have been gradually replaced by newer solutions such as eMMC and UFS, as well as BGA-based designs, which offer better density and integration.

The company said customers should plan purchases within the given timeline and work with sales channels on possible replacement options. Orders placed under the end-of-life program are expected to follow standard non-cancellable and non-returnable terms.