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ASE ramps up expansion with six new plants as AI drives packaging demand
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TSMC plans GigaFab cluster in Arizona, aiming for capacity close to Taiwan
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SK hynix plans advanced packaging plant in Cheongju for HBM production
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AI chip boom drives wafer foundry 2.0 revenue up 17% in Q3
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Glass-based MEMS packaging gains momentum as Asia-Pacific maintains lead
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TEL Unveils Advanced R&D Facility in Kumamoto to Target 1nm Tool Development
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TSMC strengthens foundry dominance with 71% market share in Q2 driven by AI demand
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TSMC market share jumps to 38% as Foundry 2.0 growth accelerates
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Advanced packaging to lift backend equipment market to $9.2 billion by 2030
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Samsung to boost US investment for 2nm, advanced packaging capacity
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