Advanced packaging

Advanced packaging to lift backend equipment market to $9.2 billion by 2030

MarketWatch

Advanced packaging to lift backend equipment market to $9.2 billion by 2030

September 1, 2025

Samsung to boost US investment for 2nm, advanced packaging capacity

MarketWatch

Samsung to boost US investment for 2nm, advanced packaging capacity

August 11, 2025

Marvell teams up with Rebellions to deliver custom AI infrastructure for sovereign markets

MarketWatch

Marvell teams up with Rebellions to deliver custom AI infrastructure for sovereign markets

July 31, 2025

Nvidia expected to take 60% of CoWoS wafer supply by 2026, TSMC to expand packaging in U.S.

MarketWatch

Nvidia expected to take 60% of CoWoS wafer supply by 2026, TSMC to expand packaging in U.S.

July 31, 2025

TSMC exits GaN foundry business as Navitas shifts to PSMC

MarketWatch

TSMC exits GaN foundry business as Navitas shifts to PSMC

July 4, 2025

IBM strengthens alliance with Rapidus to target sub-1nm chip technologies

MarketWatch

IBM strengthens alliance with Rapidus to target sub-1nm chip technologies

July 3, 2025

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

MarketWatch

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Manufacturer

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025

GlobalFoundries to invest $16 billion to expand U.S. chip manufacturing and packaging

MarketWatch

GlobalFoundries to invest $16 billion to expand U.S. chip manufacturing and packaging

June 6, 2025

Chinese OSAT players gain momentum as global packaging market grows 3% in 2024

MarketWatch

Chinese OSAT players gain momentum as global packaging market grows 3% in 2024

June 2, 2025