Advanced packaging

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans
MarketWatch

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
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Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules
Manufacturer

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
GlobalFoundries to invest $16 billion to expand U.S. chip manufacturing and packaging
MarketWatch

GlobalFoundries to invest $16 billion to expand U.S. chip manufacturing and packaging

June 6, 2025
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Chinese OSAT players gain momentum as global packaging market grows 3% in 2024
MarketWatch

Chinese OSAT players gain momentum as global packaging market grows 3% in 2024

June 2, 2025
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KLA invests $138 million to expand semiconductor R&D and manufacturing in Wales
MarketWatch

KLA invests $138 million to expand semiconductor R&D and manufacturing in Wales

May 28, 2025
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Top 10 OSAT vendors post modest growth in 2024 amid rising demand for advanced packaging
MarketWatch

Top 10 OSAT vendors post modest growth in 2024 amid rising demand for advanced packaging

May 14, 2025
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Advanced packaging equipment market expected to grow over 10% in 2024
MarketWatch

Advanced packaging equipment market expected to grow over 10% in 2024

August 29, 2024
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ASE: Advanced packaging revenue is expected to increase by more than US$250 million in 2024
MarketWatch

ASE: Advanced packaging revenue is expected to increase by more than US$250 million in 2024

July 1, 2024
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