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Glass-based MEMS packaging gains momentum as Asia-Pacific maintains lead
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TEL Unveils Advanced R&D Facility in Kumamoto to Target 1nm Tool Development
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TSMC strengthens foundry dominance with 71% market share in Q2 driven by AI demand
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TSMC market share jumps to 38% as Foundry 2.0 growth accelerates
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Advanced packaging to lift backend equipment market to $9.2 billion by 2030
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Samsung to boost US investment for 2nm, advanced packaging capacity
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Marvell teams up with Rebellions to deliver custom AI infrastructure for sovereign markets
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Nvidia expected to take 60% of CoWoS wafer supply by 2026, TSMC to expand packaging in U.S.
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TSMC exits GaN foundry business as Navitas shifts to PSMC
MarketWatch
IBM strengthens alliance with Rapidus to target sub-1nm chip technologies
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