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UMC plans wafer price hikes in second half as demand stays firm
Samsung to phase out LPDDR4/4X, shifts focus to LPDDR5 and advanced DRAM
Yageo sees steady AI demand supporting high-end passive component growth
TSMC expands global 3nm capacity to meet rising AI demand
ADI opens Thailand backend plant to expand packaging and test capacity
Broadcom expands AI chip deal with Meta to support data centers
India pushes local electronics components manufacturing with 75 ECMS projects approved
Global semiconductor equipment sales hit record $135 billion in 2025 on AI demand
Taiyo Yuden to raise prices across passive components from May
ASE ramps up expansion with six new plants as AI drives packaging demand
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