August 11, 2025 /SemiMedia/ — Samsung Electronics is accelerating its semiconductor investment in the United States, with plans to raise total spending to as much as $50 billion to advance manufacturing capacity. The company’s wafer fab in Taylor, Texas, which had slowed construction due to weaker business momentum, is now regaining pace.

Last year, Samsung cut its planned US investment from $44 billion to $37 billion amid sluggish chip demand. But with renewed policy support for domestic chip production and strengthened US–Korea trade cooperation, the South Korean tech giant is now prioritizing 2nm process development and advanced packaging facilities, aiming to better compete with Taiwan Semiconductor Manufacturing Co (TSMC) in the North American high-end manufacturing sector.

New deals with Tesla and Apple have been key drivers of Samsung’s expansion. The company is set to use its 2nm process for Tesla’s next-generation AI6 chips and will manufacture image sensors for Apple in Texas, helping bypass steep chip tariffs while deepening ties with major US tech firms.

Samsung’s flagship US fab is scheduled to start operations in October, positioning the company as the second-largest chip manufacturer in the United States after TSMC, offering customers dual sourcing options and reducing foundry losses.