September 1, 2025 /SemiMedia/ — The backend semiconductor equipment market is set for steady growth driven by demand for advanced packaging, according to research firm Yole Group. Industry revenues are projected to reach $6.9 billion in 2025 and expand to $9.2 billion by 2030, reflecting a compound annual growth rate of 5.8%.

The adoption of high-bandwidth memory (HBM) stacking, chiplet integration, and high I/O substrates is reshaping investment strategies of foundries, IDMs and OSATs, fueling demand for next-generation tools.

Thermocompression bonding (TCB) systems are playing a central role in enabling HBM capacity expansion. Yole expects the TCB segment to rise from $542 million in 2025 to $936 million in 2030, a CAGR of 11.6%, led by suppliers such as Hanmi and ASMPT. Hybrid bonding tools are forecast to grow even faster, from $152 million in 2025 to $397 million in 2030, with BESI leading the segment while ASMPT, SET and Shibaura scale up from pilot lines to mass production.

Other backend processes are also on an upward trajectory. Flip-chip bonders are projected to hit $622 million by 2030, while wafer thinning equipment is expected to rise from $582 million in 2025 to $845 million in 2030. Yole said the integration of front-end precision into packaging lines, including high-accuracy placement and clean copper interconnects, will be critical to sustaining growth.

AI and high-performance computing demand will remain the structural driver for backend equipment expansion in the coming years.