November 05, 2025 /SemiMedia/ — The global MEMS substrate market is forecast to rise from US$2.4 billion in 2025 to US$3.23 billion by 2030, MarketsandMarkets said, citing stronger adoption of IoT endpoints, miniaturised medical devices and denser 5G sensor deployments.

Glass substrates are expected to show the fastest growth, boosted by demand for higher interconnect density and better signal integrity. Glass is gaining favour as more optical, biomedical and environmental sensors move toward compact system-level packaging, and improvements in laser drilling and anodic bonding are cutting process costs.

Asia-Pacific is set to remain the largest market through 2030. Consumer electronics brands across China, Japan and South Korea are adding more MEMS content to smartphones, wearables and AR/VR platforms. The region’s manufacturing base for wafers, materials and OSAT services puts it in a strong position to capture this shift.

Key suppliers in the market include CoorsTek, CeramTec, Kyocera, AGC, PLANOPTIK, Shin-Etsu, WaferPro, Schott and Okmetic.

Industry analysts said glass-based MEMS packaging is emerging as a structural path for next-generation high-performance miniaturised electronics, rather than a simple materials substitution cycle.