July 17, 2026 / SemiMedia / — Powertech Technology Inc. said its board has approved a plan to establish a panel-level advanced packaging joint venture with Broadcom Technologies in Singapore, with Powertech planning to invest $400 million in the project.

The investment will be made in stages according to the construction schedule and funding requirements of the Singapore facility. Powertech said the venture supports its international manufacturing strategy and will position advanced packaging capacity closer to the supply chains of global customers.

The joint venture will focus on additive finer-geometry redistribution layer technology for advanced package substrates. Finer RDL structures provide the high-density electrical connections required to integrate large processors, chiplets, memory and other components in increasingly complex semiconductor packages.

Powertech said it will continue investing in advanced packaging research, development and capacity expansion in Taiwan, where the company intends to retain its core technologies and key intellectual property. The Singapore project will not affect its existing or future FOPLP cooperation with other customers.

FOPLP processes use large rectangular panels instead of circular wafers, potentially improving substrate utilization and providing more packaging area for large chips and multi-die integration. Powertech is targeting applications including AI processors, CPUs, ASICs, optical engines and co-packaged optics.

Powertech Chairman D.K. Tsai previously said the company aims to complete customer qualification for its FOPLP products by the end of 2026 and begin ramping shipments in 2027. The company expects its FOPLP capacity to reach full utilization around the middle of 2028 as demand from AI chips and silicon photonics applications expands.

Tsai has described Powertech’s FOPLP technology as similar in some respects to TSMC’s CoWoS-L and CoWoS-R platforms, while offering a larger panel format. The company sees this as an opportunity to participate in the growing market for large AI chips and heterogeneous integration.

The joint venture remains subject to approval from Taiwan’s Investment Review Department and other relevant authorities. Its completion schedule, final transaction terms and subsequent implementation will depend on regulatory approval, execution of definitive agreements and fulfillment of other closing conditions.