AI chip packaging

Powertech plans $400 million Broadcom PLP venture in Singapore
MarketWatch

Powertech plans $400 million Broadcom PLP venture in Singapore

July 17, 2026
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ASE raises advanced packaging prices by more than 20% as AI demand strains capacity
MarketWatch

ASE raises advanced packaging prices by more than 20% as AI demand strains capacity

July 2, 2026
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Supply chain sources say TSMC and Winbond are working on WoW memory stacking for AI chips
MarketWatch

Supply chain sources say TSMC and Winbond are working on WoW memory stacking for AI chips

June 29, 2026
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ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips
MarketWatch

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
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MGC raises semiconductor materials prices 30% as packaging material costs rise
MarketWatch

MGC raises semiconductor materials prices 30% as packaging material costs rise

April 3, 2026
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TSMC speeds up U.S. advanced packaging plans as CoWoS demand surges
Manufacturer

TSMC speeds up U.S. advanced packaging plans as CoWoS demand surges

December 9, 2025
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ASE to expand semiconductor packaging capacity in Malaysia and Kaohsiung
MarketWatch

ASE to expand semiconductor packaging capacity in Malaysia and Kaohsiung

February 19, 2025
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