Advanced packaging

Global chip equipment spending hits record $36.55 billion in Q1 as AI investment grows
MarketWatch

Global chip equipment spending hits record $36.55 billion in Q1 as AI investment grows

June 11, 2026
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ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips
MarketWatch

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
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Amkor expands Arizona packaging plans as AMD joins advanced packaging customers
MarketWatch

Amkor expands Arizona packaging plans as AMD joins advanced packaging customers

May 22, 2026
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AI Demand to Push Global Semiconductor Packaging Market to $618.9 Billion
MarketWatch

AI Demand to Push Global Semiconductor Packaging Market to $618.9 Billion

May 11, 2026
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AI demand keeps 3nm and CoWoS capacity tight through 2027
MarketWatch

AI demand keeps 3nm and CoWoS capacity tight through 2027

May 7, 2026
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ASE ramps up expansion with six new plants as AI drives packaging demand
MarketWatch

ASE ramps up expansion with six new plants as AI drives packaging demand

April 14, 2026
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TSMC plans GigaFab cluster in Arizona, aiming for capacity close to Taiwan
MarketWatch

TSMC plans GigaFab cluster in Arizona, aiming for capacity close to Taiwan

April 6, 2026
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SK hynix plans advanced packaging plant in Cheongju for HBM production
MarketWatch

SK hynix plans advanced packaging plant in Cheongju for HBM production

January 15, 2026
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AI chip boom drives wafer foundry 2.0 revenue up 17% in Q3
MarketWatch

AI chip boom drives wafer foundry 2.0 revenue up 17% in Q3

December 31, 2025
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Glass-based MEMS packaging gains momentum as Asia-Pacific maintains lead
MarketWatch

Glass-based MEMS packaging gains momentum as Asia-Pacific maintains lead

November 5, 2025
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