Advanced packaging

U.S. signs $874 million CHIPS R&D LOIs with seven semiconductor companies
MarketWatch

U.S. signs $874 million CHIPS R&D LOIs with seven semiconductor companies

July 31, 2026
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ASE raises 2026 capex to $10.5 billion as advanced packaging demand accelerates
Manufacturer

ASE raises 2026 capex to $10.5 billion as advanced packaging demand accelerates

July 31, 2026
0
UMC raises 2026 capex to $2 billion and expands Singapore and Tainan fabs
Manufacturer

UMC raises 2026 capex to $2 billion and expands Singapore and Tainan fabs

July 30, 2026
0
GlobalFoundries signs $300 million U.S. silicon photonics funding LOI
Manufacturer

GlobalFoundries signs $300 million U.S. silicon photonics funding LOI

July 30, 2026
0
NVIDIA provides $1.5 billion prepayment to expand Amkor’s U.S. AI packaging capacity
Manufacturer

NVIDIA provides $1.5 billion prepayment to expand Amkor’s U.S. AI packaging capacity

July 24, 2026
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TSMC adds $100 billion to Arizona investment as AI chip demand stays strong
MarketWatch

TSMC adds $100 billion to Arizona investment as AI chip demand stays strong

July 20, 2026
0
Powertech plans $400 million Broadcom PLP venture in Singapore
MarketWatch

Powertech plans $400 million Broadcom PLP venture in Singapore

July 17, 2026
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UMC begins advanced photonic chip production in Singapore
MarketWatch

UMC begins advanced photonic chip production in Singapore

July 14, 2026
0
Global Foundry 2.0 revenue reaches $86 billion in Q1 as AI demand grows
MarketWatch

Global Foundry 2.0 revenue reaches $86 billion in Q1 as AI demand grows

July 1, 2026
0
ASE raises 2026 capex to $8.5 billion as AI drives advanced packaging demand
MarketWatch

ASE raises 2026 capex to $8.5 billion as AI drives advanced packaging demand

June 25, 2026
0

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