September 24, 2026 / SemiMedia / — onsemi is collaborating with Valens Semiconductor to develop a cost-optimized 3-megapixel automotive image sensor with MIPI A-PHY connectivity integrated directly into the sensor, targeting high-volume automotive camera applications.

Under the agreement, Valens will work with onsemi to integrate its MIPI A-PHY connectivity technology into onsemi's image sensor platform. The approach is intended to reduce the number of separate components required in automotive camera systems while giving OEMs and Tier 1 suppliers a simpler path to adopting the A-PHY standard.

Ahmed Salem, Vice President and General Manager of the Intelligent Sensing Group at onsemi, said automotive imaging systems are becoming larger and more complex, increasing demand for architectures that reduce component count while maintaining performance and supporting industry-standard connectivity.

The companies are initially targeting the 3MP segment. Most automotive image sensors currently fall within the 1MP to 3MP range, while automakers are gradually moving toward higher-resolution cameras for ADAS, surround-view, e-mirror and other vision applications.

MIPI A-PHY is an automotive high-speed sensor connectivity standard designed to link cameras and other sensors with centralized processing systems. onsemi is also expanding its automotive imaging portfolio for ADAS and e-mirror applications as vehicle architectures rely on a growing number of high-resolution sensors.

Neither company disclosed financial terms or a commercial launch date for the planned integrated 3MP sensor. The collaboration currently establishes a development program, with further product and availability details expected later.