SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › GlobalFoundries Secures $375 Million CHIPS R&D Award to Expand Quantum Semiconductor Manufacturing
  • 0

GlobalFoundries Secures $375 Million CHIPS R&D Award to Expand Quantum Semiconductor Manufacturing

SemiMediaEdit
September 9, 2026

September 9, 2026 / SemiMedia / — GlobalFoundries has finalized an agreement with the U.S. Department of Commerce's CHIPS Research and Development Office for up to $375 million in R&D funding to accelerate its Quantum Technology Solutions business and expand domestic quantum semiconductor manufacturing.

The funding will be provided over five years and tied to established research and development milestones. Through its QTS platform, GlobalFoundries plans to expand access to advanced manufacturing capabilities and help quantum computing companies move from research and prototyping toward commercial-scale production.

GlobalFoundries launched Quantum Technology Solutions in May. The platform is designed to support quantum processors, cryogenic readout and control ICs, advanced packaging and superconducting interconnects, building on the company's existing work in cryogenic CMOS, materials and heterogeneous integration.

The company said the program is intended to strengthen the manufacturing infrastructure needed as quantum computing moves beyond laboratory development toward scalable hardware production.

Separately, GlobalFoundries signed a letter of intent with the Commerce Department in July for a proposed $300 million CHIPS R&D award focused on next-generation silicon photonics, optical materials and advanced packaging for AI and high-performance computing systems.

With both programs, GlobalFoundries is expanding its role in two emerging areas of advanced computing infrastructure: quantum semiconductor manufacturing and high-bandwidth optical interconnects for AI data centers.

Related

Advanced packaging CHIPS act GlobalFoundries quantum computing quantum semiconductor Quantum Technology Solutions silicon photonics
ASML and TSMC Target 12-Inch EUV Mask Pilot Line by 2031 and Advanced-Node Production by 2033
Previous
Samsung Invests ¥40 Billion in Yokohama AI Chip Advanced Packaging R&D Center
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Samsung Invests ¥40 Billion in Yokohama AI Chip Advanced Packaging R&D Center

Samsung Invests ¥40 Billion in Yokohama AI Chip Advanced Packaging R&D Center

September 9, 2026
0
ASML and TSMC Target 12-Inch EUV Mask Pilot Line by 2031 and Advanced-Node Production by 2033

ASML and TSMC Target 12-Inch EUV Mask Pilot Line by 2031 and Advanced-Node Production by 2033

September 9, 2026
0
Intel PC CPU Prices Reportedly Set to Rise About 10% in October as Small Core Lines Face Possible EOL

Intel PC CPU Prices Reportedly Set to Rise About 10% in October as Small Core Lines Face Possible EOL

September 8, 2026
0
Global Semiconductor Sales Reach $146.8 Billion in July, Up 135.1% Year Over Year

Global Semiconductor Sales Reach $146.8 Billion in July, Up 135.1% Year Over Year

September 7, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator