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Denso drops Rohm acquisition plan, keeps focus on SiC collaboration

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May 4, 2026

May 4, 2026 /SemiMedia/ — Denso Corporation has withdrawn its proposal to acquire Rohm Semiconductor after the two sides failed to agree on valuation and deal terms.

The Japanese automotive supplier had made an offer worth about 1.3 trillion yen ($8.2 billion), but did not secure support from Rohm’s board. Denso said after reviewing the potential impact on its long-term business, it decided not to move forward with the deal.

Despite the setback, ties between the two companies remain in place. Denso holds nearly a 5% stake in Rohm, and the companies have been working together on power semiconductor technologies, especially silicon carbide (SiC) devices for automotive systems.

Demand for SiC power devices is rising as electric vehicles and powertrain systems require higher efficiency and better thermal performance. Denso has been exploring ways to use Rohm’s technology across a wider range of automotive applications, including electrification and connected systems.

Rohm, for its part, has also been in talks with other Japanese groups such as Toshiba and Mitsubishi Electric to explore cooperation in power semiconductors.

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Automotive chips Denso Rohm deal Electronic components distributor electronic components news Japan semiconductor industry SiC power semiconductors
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