July 20, 2026 / SemiMedia / — ChangXin Memory Technologies’ DRAM orders have reportedly extended through the end of 2027 as major PC manufacturers move to secure memory supplies during a continuing global shortage.

According to supply chain sources cited by DIGITIMES, leading PC manufacturers have completed product testing involving CXMT memory. Passing qualification, however, does not guarantee that each customer will receive its requested volume, as CXMT is reportedly prioritizing large customers that can place substantial orders and make longer-term commitments.

Smaller PC manufacturers may face greater difficulty obtaining allocations as larger brands secure available output. CXMT has not publicly confirmed the reported backlog or disclosed customer names, contract volumes and individual supply arrangements.

Motherboard manufacturers are also improving compatibility with CXMT-based DDR5 modules. MSI recently released beta BIOS updates for selected AMD AM5 motherboards in China, validating CXMT memory at up to DDR5-8200 on certain dual-DIMM boards and DDR5-7200 on selected four-DIMM models. The updates apply to limited products and should not be interpreted as universal platform support.

The move toward CXMT comes as Samsung Electronics, SK hynix and Micron direct more investment and advanced production capacity toward HBM and server DRAM. Expanding AI data centers are consuming increasing amounts of memory, tightening the availability of DDR4 and DDR5 products for PCs and other consumer systems.

CXMT’s manufacturing scale has expanded rapidly. Its monthly capacity was estimated at around 40,000 12-inch wafers in 2020, while its three existing DRAM fabs in Hefei and Beijing are now reported to have combined capacity of approximately 300,000 wafers per month.

SemiAnalysis expects CXMT to reach about 350,000 wafer starts per month by the end of 2026, approaching Micron’s estimated capacity of roughly 385,000. This would make CXMT a more important source of PC and consumer DRAM, particularly within China.

Similar wafer capacity does not mean that two manufacturers produce the same number of DRAM bits or generate equivalent revenue. Process technology, die density, yield, product mix and HBM capabilities all influence effective output. CXMT is increasing its DDR5 and LPDDR production, but it continues to trail the three established suppliers in advanced DRAM and HBM technology.

Additional CXMT capacity could provide PC manufacturers with another source of DDR5 supply, but it is unlikely to eliminate the broader DRAM shortage in the near term. If AI infrastructure continues to absorb advanced memory capacity, long-term purchasing agreements and customer allocation priorities are likely to become more important across the PC supply chain.