April 22, 2026 /SemiMedia/ — The European Union is set to roll out its Chips Act 2.0 on May 27, with a stronger focus on faster funding and support for local semiconductor players, according to officials involved in the discussions.

The new plan builds on the first Chips Act but aims to improve how funding is delivered. A more direct and faster process is expected, as delays in financial support could slow down projects at a time when global competition in semiconductors is intensifying.

Another key change is the shift in subsidy focus. While the earlier framework aimed to boost manufacturing capacity in Europe and led to funding for some non-European firms, the updated version is expected to place more weight on developing local companies and strengthening the regional supply chain.

Officials from Spain’s Catalonia region said cooperation across EU member states has often moved slowly. In many cases, regional governments have taken the lead, as they have a clearer view of their role in the semiconductor value chain.

At the national level, countries tend to compete for positions across the full value chain, which adds complexity and makes cross-border cooperation more cautious. Long-standing competition within Europe has also made it harder to build a unified industry structure.