High-capacitance embedded MLCCs for AI server power delivery

December 10, 2025 /SemiMedia/ — Taiyo Yuden has started mass production of an embeddable multilayer ceramic capacitor that delivers 100 μF in a 2012 size (2.0 x 1.25 mm), targeting power-line decoupling in AI servers and other high-performance computing equipment. The device expands the company’s embedded MLCC lineup, following the introduction of a 1005-size model earlier this year.

Manufacturing expansion and availability

The new component addresses the demand for stable power delivery in advanced processors, where embedded parts require highly accurate external-electrode flatness to ensure reliable board-level connections. By refining its electrode formation and other core manufacturing technologies, Taiyo Yuden achieved high capacitance in the larger 2012 footprint.

Mass production began in November at the company’s Tamamura Plant in Gunma Prefecture. Samples are available at 120 yen per unit and are aimed at applications in data-center servers, telecom infrastructure and industrial equipment requiring robust power-decoupling performance.