TDK releases mechanically decoupled ultrasonic modules for collision avoidance
September 18, 2023
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GF and ST finalize agreement for new 300mm semiconductor fab in France
June 7, 2023
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Infineon launches CoolGaN™ 600 V GIT HEMT portfolio with superior performance and quality
May 8, 2023
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Japan aims to triple semiconductor sales by 2030
April 4, 2023
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Silicon Labs introduces new bluetooth SoC and MCU for small form-factor devices
March 17, 2023
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TDK releases industry's first common mode filter for automotive ethernet 10BASE-T1S
February 14, 2023
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Infineon and TSMC announce the introduction of RRAM technology for automotive AURIX™ TC4x product family
November 28, 2022
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ST releases new advanced 6-axis IMU with embedded sensor fusion and AI
November 25, 2022
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IC Insights: DRAM market to fall by -18% in 2022
November 25, 2022
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Omdia: Gobal semiconductor market size in Q3 2022 fell by 7% from Q2 2022
November 24, 2022
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Automotive chip suppliers cut automotive MCU, CIS test orders in the fourth quarter
November 24, 2022
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AMD issues price increase notice
November 23, 2022
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