SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Japan’s semiconductor equipment sales fell 17.1% year-on-year in October
  • 0

Japan’s semiconductor equipment sales fell 17.1% year-on-year in October

SemiMediaEdit
November 27, 2023

November 27, 2023 /SemiMedia/ -- According to a report released by the Semiconductor Equipment Association of Japan (SEAJ) on November 24, Japanese manufacturing equipment sales (including exports) fell 3.7% month-on-month in October (298.738 billion yen in September 2023) to 287.54 billion yen. A decrease of 17.1% compared with the same period last year (347.054 billion yen in October 2022).

This is the fifth consecutive month that Japanese semiconductor equipment sales have shrunk year-on-year, and the fifth consecutive month that monthly sales have fallen below 3,000 yen. Although the decline has been smaller than the previous month (a 21.6% decline in September 2023) , but it has experienced double-digit percentage declines for four consecutive months.

From January to October 2023, Japan's chip equipment sales totaled 2,988.641 billion yen, down 6.9% from the same period last year (from January to October 2022, it was 3,209.608 billion yen).

Related

Electronic component supplier electronic components news Electronic parts supplier semiconductor equipment market
Infineon launches 650 V CoolMOS™ CFD7A in QDPAK package for energy-efficient electric vehicle fast charging
Previous
ST announces long-term agreement with ERG to supply renewable energy
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron’s HBM4 delay threatens its position in the next AI memory cycle

Micron’s HBM4 delay threatens its position in the next AI memory cycle

November 7, 2025
0
Kaga Electronics expands Thai PCBA capacity to capture China manufacturing shift

Kaga Electronics expands Thai PCBA capacity to capture China manufacturing shift

November 7, 2025
0
SEMI says AI-driven demand supports 12-inch wafer expansion in Q3

SEMI says AI-driven demand supports 12-inch wafer expansion in Q3

November 7, 2025
0
Infineon TLE994x/TLE995x SoC targets small automotive BLDC and BDC motors

Infineon TLE994x/TLE995x SoC targets small automotive BLDC and BDC motors

November 6, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator