April 5, 2024 /SemiMedia/ -- Kyung Kye-hyun, head of Samsung's semiconductor business and co-CEO, recently said that Samsung Electronics has established a new high-bandwidth memory (HBM) dedicated team within its memory chip division to improve quality and production.
The new team will be responsible for the development and sales of DRAM and NAND. Hwang Sang-joon, Samsung's executive vice president and head of DRAM products and technology, will lead the new team.
It is reported that this is the second HBM dedicated team that Samsung has established since January 2024 when it created a dedicated HBM team consisting of 100 people from the Device and Solutions (DS) department.
In order to seize the opportunity in the artificial intelligence chip market, Samsung will develop two types of cutting-edge memory chips HBM and Mach series at the same time. Samsung plans to mass-produce HBM3E within this year and HBM4 in 2025.
"Customers who want to develop customized HBM4 chips will cooperate with us. Thanks to the efforts of the professional team, Samsung will gain the leadership position in the HBM market," Kyung Kye-hyun said.
Samsung had previously predicted that the company's HBM chip production would increase 2.9 times in 2024 compared with last year.
