June 29, 2026 /SemiMedia/ — Supply chain sources said TSMC is accelerating efforts to build a local DRAM supply chain and is working with Winbond Electronics on wafer-on-wafer stacking technology for AI-related chip applications.

The cooperation is said to focus on WoW, an advanced 3D wafer stacking technology that combines memory wafers with TSMC logic process wafers. Winbond is expected to provide DRAM and other memory wafers for integration with TSMC’s logic wafers.

Winbond said it does not comment on individual customers or cooperation projects. TSMC had not responded as of publication.

WoW is viewed as an important integration technology for next-generation AI chips. Through hybrid bonding, logic and memory wafers can be vertically stacked and connected by a large number of microscopic copper contacts, shortening data transmission paths while improving bandwidth, latency and energy efficiency.

As AI servers and high-performance computing systems require higher memory bandwidth, larger capacity and better power efficiency, advanced packaging and 3D stacking technologies are becoming more important. Compared with conventional packaging, WoW can support shorter data paths between logic and memory, helping address memory bottlenecks in AI chip systems.

TSMC’s WoW memory wafer supply has historically relied heavily on major global memory suppliers including Samsung Electronics, SK hynix and Micron. However, as global memory supply remains tight, AI supply chains are seeking more diversified and stable sources of memory.

Industry sources said Winbond’s entry into TSMC’s WoW partner ecosystem could help improve memory supply flexibility for AI chip integration, while giving Winbond an opportunity to move from niche memory markets into the core AI server supply chain.

Winbond has long focused on specialty DRAM and NOR Flash products. The company has experience in specialty memory processes, 12-inch wafer manufacturing, quality control and long-lifecycle supply, all of which are important for advanced wafer-level integration.

Analysts said TSMC’s requirements for WoW partners are high. Suppliers must have mature wafer production capability, strong yield control, specialty process expertise and experience in wafer-level integration.

For TSMC, developing local memory partners could strengthen the resilience of its AI chip supply chain. As HBM, DRAM and advanced packaging resources remain tight, the company is expected to continue deepening cooperation with global memory leaders while also expanding local supply chain participation.

For Winbond, successful participation in WoW could mark a shift from AI-adjacent memory supply into higher-value AI chip integration. As WoW technology is adopted in more AI platforms, the company could gain new growth opportunities.