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SK hynix plans 1,100 trillion won investment to expand AI memory production

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June 30, 2026

June 30, 2026 /SemiMedia/ — SK hynix has developed a mid- to long-term investment strategy worth 1,100 trillion won to expand memory semiconductor production across Yongin, Cheongju and southwestern South Korea.

The company plans to invest 600 trillion won in Yongin, 100 trillion won in Cheongju and 400 trillion won in southwestern South Korea in phases. The investment will cover fab construction, production equipment, land acquisition and advanced packaging capacity.

Yongin will become a core production base for SK hynix’s future DRAM expansion. The company is accelerating construction of the Yongin semiconductor cluster to meet rapidly growing DRAM demand. It aims to complete construction of the fourth fab by 2033, about 12 years earlier than the original 2045 schedule.

With phased investment in manufacturing facilities and production equipment, total investment in the Yongin cluster is expected to reach 600 trillion won.

SK hynix also plans to expand NAND Flash capacity through a 100 trillion won investment in Cheongju. The investment will be used to build a new NAND Flash fab, install manufacturing equipment and expand advanced packaging capacity for HBM back-end processing.

The company aims to further develop Cheongju into an integrated manufacturing hub covering NAND Flash, HBM back-end processes and advanced packaging technologies.

In southwestern South Korea, SK hynix plans to invest 400 trillion won to build a new semiconductor cluster. The project will proceed in phases and include land acquisition, fab construction and production equipment installation. The region is expected to provide large-scale sites and supporting infrastructure, including stable power and water supply, for the company’s next manufacturing center.

Industry analysts said the investment plan reflects how AI demand is reshaping long-term capital spending in the memory industry. As AI servers, GPUs and accelerators require more HBM, advanced DRAM and high-capacity storage, memory suppliers are expanding both front-end wafer capacity and back-end packaging capability.

SK hynix currently operates key production bases in Icheon and Cheongju, while expanding its manufacturing footprint to Yongin and potentially southwestern South Korea. Through the multi-region investment plan, the company aims to strengthen long-term supply capacity and improve its competitiveness in AI memory.

The investment is also seen as part of South Korea’s broader effort to strengthen its AI semiconductor foundation. As companies such as Samsung Electronics and SK hynix increase investment, South Korea is seeking to turn its memory leadership into a stronger position in the global AI infrastructure supply chain.

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AI memory demand DRAM capacity Electronic components distributor electronic components news HBM packaging Semiconductor manufacturing SK hynix investment
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