October 16, 2026 / SemiMedia / — Intel has secured foundry projects with Broadcom, Google, Apple, AMD, Microsoft and Nvidia, according to KeyBanc research cited by Wccftech. The analysts’ findings follow a recent trip to Asia. The reported projects span networking switches, server CPUs, client compute tiles and gaming GPUs, although customers have not publicly confirmed their scope, value or production schedules.

Apple is among the largest opportunities identified in the research. KeyBanc believes the work covers multiple generations of A-series and M-series chips using Intel’s 14A process, rather than the previously rumored 18A-P. The analysts estimate roughly 600,000 wafers and potential revenue of $15 billion to $20 billion. No timeframe was specified, so those figures should not be read as annual orders or sales.

Amazon Web Services, Anthropic and the SpaceX/Tesla Terafab initiative are reportedly still evaluating Intel’s 18A-P and 14A processes. KeyBanc expects most of these potential projects to favor 14A.

Advanced packaging could bring additional business. KeyBanc estimates that Google’s Humufish TPU v9 and Icefish TPU v10 programs could represent a $12 billion to $15 billion revenue opportunity for Intel’s EMIB-T technology. Qualcomm’s AI300, Amazon’s Trainium 3 and Microsoft’s Cobalt 400 were also identified as potential packaging programs.

Substrate yields could limit the pace of the ramp, however. KeyBanc estimates EMIB-T substrate yields at 50% to 60% for Ibiden and 20% to 30% for Unimicron, potentially constraining Google’s Humufish production. These yield figures and revenue projections are analyst estimates rather than company disclosures.