October 19, 2026 / SemiMedia / — TSMC will build another 3nm fab in Tainan, with volume production scheduled for the first half of 2028, Chairman and CEO C.C. Wei said during the company’s third-quarter earnings call on October 15. The project adds to three previously planned 3nm fabs in Taiwan, the United States and Japan.

Wei said TSMC historically stopped expanding a process node once it reached its target capacity. However, the company expects strong demand for 3nm technology to continue for several years, prompting further investment.

The previously announced Tainan fab remains on schedule to begin volume production in the first half of 2027. In Arizona, construction of TSMC’s second fab is complete, with equipment move-in and installation underway. Production is scheduled for the third quarter of 2027, slightly ahead of the earlier plan. The company’s second fab in Japan will also use 3nm technology, with production expected in 2028.

Alongside the new facilities, TSMC is converting some 5nm equipment in Tainan to support 3nm production and improving productivity to increase wafer output. These measures will supplement the capacity coming online at the new fabs.