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ST launches AI-enabled MEMS vibration sensor for industrial condition monitoring

SemiMediaEdit
June 3, 2026

June 3, 2026 /SemiMedia/ — STMicroelectronics has introduced the IIS3DWB10IS intelligent vibration sensor for industrial condition monitoring applications that require high accuracy, reliability and energy efficiency.

Built on ST MEMS technology, the device integrates the company’s ISPU 2.0 intelligent sensor processing unit, bringing digital signal processing and AI inference closer to the sensing element.

The IIS3DWB10IS can measure vibrations and shocks up to 200g at frequencies of 10 kHz and above, targeting industrial equipment where early fault detection can reduce unplanned downtime and improve production efficiency.

Vibration analysis remains one of the most important methods used in condition monitoring, particularly for rotating and oscillating machinery such as motors, pumps, fans, compressors and industrial processing equipment. Detecting mechanical wear or bearing failures earlier can help manufacturers schedule maintenance before equipment stoppages occur.

ST said the IIS3DWB10IS is the first digital wide-bandwidth sensor with embedded processing designed to meet the requirements of high-end industrial condition monitoring, offering a potential alternative to piezoelectric sensors.

The device provides a dynamic range up to 200g and a noise floor as low as 35 µg/√Hz, which ST said is comparable to piezoelectric sensor noise performance. The sensor also includes a 2048 × 80-bit FIFO register and an accurate temperature sensor.

ISPU 2.0 adds hardware accelerators for real-time signal processing and edge AI inference. The programmable processing unit supports 40 MIPS and 40 MFLOPS digital signal processing performance, up to four times higher than the previous generation. Its sensor interface also supports six times faster data transfer with the MEMS circuitry.

ST’s software ecosystem supports vibration monitoring algorithms running inside the ISPU, including FFT, filtering, envelope analysis, velocity severity and anomaly detection. This allows more processing to happen directly at the sensor level, reducing latency and power consumption in industrial monitoring systems.

The IIS3DWB10IS supports operation up to 125°C and is included in ST’s 10-year industrial longevity program.

The device is offered in a 4.5 mm × 4.5 mm × 1.5 mm 16-lead LGA package with wettable flanks for automated optical inspection in high-quality surface-mount assembly processes.

Availability
The IIS3DWB10IS is scheduled to be available by July 2026, with pricing from $25 for orders of 1,000 pieces.

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edge AI sensor Electronic components distributor electronic components news industrial condition monitoring MEMS vibration sensor predictive maintenance sensor STMicroelectronics IIS3DWB10IS
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