SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › ASML: Excessive export controls may raise chip costs
  • 0

ASML: Excessive export controls may raise chip costs

SemiMediaEdit
January 27, 2023

Jan. 27, 2023 /SemiMedia/ -- According to Bloomberg, ASML CEO Peter Wennink recently said that excessive regulatory measures may lead to higher costs for chip manufacturers.

The Netherlands and Japan, home to major suppliers of semiconductor manufacturing equipment, are about to join a U.S. government-led effort to curb exports of the technology to China, where ASML could face more restrictions on sales to Chinese customers.

“Chip availability may decrease, possibly due to export controls going too far, which also means we will have a less efficient infrastructure and costs will likely go up,” Wennink said.

Under pressure from the United States, the Dutch government has restricted ASML from exporting its most advanced lithography machines to China since 2019, which Wennink said has instead benefited U.S. companies that sell non-cutting-edge technology to China.

Wennink said the growing divide in the global chip industry is due in part to a surge in government investment and escalating trade tensions, which are creating more hurdles and friction for the broader chip industry.

Related

ASML electronic components news Electronic components supplier Electronic parts supplier
onsemi announces strategic agreement with Volkswagen Group to strengthen SiC technology in next-generation electric vehicles
Previous
Murata announces closure of Saitama Murata Manufacturing’s subsidiaries 
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator