SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Intel announces the first processor developed using AI
  • 0

Intel announces the first processor developed using AI

SemiMediaEdit
August 21, 2019

According to Reuters, Intel announced its first processor to use artificial intelligence. Designed for large data centers, the chip was launched after investing in Israeli artificial intelligence startups including Habana Labs and NeuroBlade.

It is reported that the chip was developed by Intel Israel's Haifa company, based on 10nm Ice Lake processing, may be named Springhill or Nervana NNP-I, Intel said that the chip can perform high-load tasks with the lowest energy consumption.

Naveen Rao, general manager of Intel Artificial Intelligence Products Group, said, "In order to achieve the ubiquitous future goal of AI, we have to deal with a large amount of data, which needs to ensure that resources can be effectively utilized and the collected chips can be processed in real time."

Intel emphasizes that Springhill will be used in Intel Xeon processors in the future to improve computing power in complex computing areas such as data centers. Intel also revealed that Facebook is already using the product.

Related

AI electronic components news Intel Nervana NNP-I Springhill
Toshiba introduces XFMExpress standard to minimize NVMe SSD into memory card size
Previous
MediaTek will produce its first 5G chip at TSMC
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Vishay expands AC03-CS resistor series with surface-mountable WSZ lead form

Vishay expands AC03-CS resistor series with surface-mountable WSZ lead form

June 12, 2025
0
Foundry revenue slips in Q1 amid geopolitical rush orders; AI and China subsidies to lift Q2 outlook

Foundry revenue slips in Q1 amid geopolitical rush orders; AI and China subsidies to lift Q2 outlook

June 11, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator