SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Skyworks introduced SkyOne Ultra 3.0 devices for automotive connectivity
  • 0

Skyworks introduced SkyOne Ultra 3.0 devices for automotive connectivity

SemiMediaEdit
December 14, 2018

Skyworks Solutions has released SkyOne Ultra 3.0, a next-generation front-end device designed for advanced automotive connectivity applications.

SkyOne Ultra 3.0 consists of the SKYA230xx front-end module, SKYA220xx power amplifier, SKYA250xx diversity receive (DRx) and MIMO modules, SKYA21xxx low noise amplifier (LNA) kit and discrete switches, compatible with all leading chipset vendors. In addition, the connected device is optimized for North America, Europe, China and other markets.

In addition to extended operating temperature range and extended production life, the kit provides robust, low-latency, high-bandwidth LTE connectivity. This portfolio exceeds the requirements of LTE CAT 16 and can be extended to comply with the 5G New Radio (NR) standard and supports all cellular bands worldwide.

“With the introduction of SkyOne Ultra 3.0 for automotive, Skyworks is enabling the full benefit of high-speed data and real-time communication in the connected car. At a higher level, in-vehicle technologies and rapidly changing standards are being adopted at a pace previously unheard of in the automotive industry – particularly with the advent of 5G and the move toward autonomous driving. Our differentiated portfolio takes seamless connectivity to the next level, making the driving experience increasingly smarter and safer,” said Joel King, senior VP & general manager of mobile solutions at Skyworks.

Related

automotive connectivity electronic components news SkyOne Ultra 3.0 Skyworks
Vishay automotive MLCC wins 2018 Innovator Award
Previous
Infineon sets up new chip R&D center in Germany
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Diotec launches SiC Schottky diode for fast MOSFET short-circuit protection

Diotec launches SiC Schottky diode for fast MOSFET short-circuit protection

August 20, 2025
0
TSMC sets $30,000 price for 2nm wafers, targets AI and HPC clients

TSMC sets $30,000 price for 2nm wafers, targets AI and HPC clients

August 20, 2025
0
SK Hynix strengthens balance sheet on booming HBM demand

SK Hynix strengthens balance sheet on booming HBM demand

August 20, 2025
0
Littelfuse launches TMR-based magnetic angle sensors for precision industrial and automotive control

Littelfuse launches TMR-based magnetic angle sensors for precision industrial and automotive control

August 19, 2025
0
1
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator