SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › TSMC invests US$3.35 billion to upgrade production capacity
  • 0

TSMC invests US$3.35 billion to upgrade production capacity

SemiMediaEdit
November 14, 2018

TSMC today announced that it has approved a $3.35 billion capital budget to build plants, expand and upgrade advanced process capacity.

TSMC pointed out that the capital budget will be used to build factories, expand and upgrade advanced process capacity, upgrade special process capacity, convert logic process capacity to special process capacity, and develop capital budget and recurring capital budget in the first quarter of next year.

It is worth noting that IC Insights announced today that the top 15 semiconductor suppliers this year, TSMC was surpassed by SK hynix, ranking from the third place last year to the fourth place.

IC Insights pointed out that Samsung's sales will increase by more than 25% annually among the top 15 semiconductor suppliers in the world this year; SK Hynix's annual growth rate is the highest among all manufacturers, with an annual growth rate of 41%; TSMC’s annual growth rate is 6%, which is lagging behind other manufacturers in terms of growth.

In addition, TSMC's board of directors today approved the appointment of Xilinx's former CEO Moshe N. Gavrielov as a member of the remuneration committee, which is effective today. TSMC said that it mainly hopes to enhance the independence of the remuneration committee.

Related

NEWS TSMC upgrade production capacity
Mouser announces expansion plan
Previous
IC Insight releases global semiconductor supplier annual revenue rankings
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

NXP releases 10BASE-T1S PMD transceivers for edge Ethernet

NXP releases 10BASE-T1S PMD transceivers for edge Ethernet

February 26, 2026
0
SK hynix says memory market turns seller-driven, prices seen rising through 2026

SK hynix says memory market turns seller-driven, prices seen rising through 2026

February 24, 2026
0
Infineon rolls out isolated gate drivers to support next wave of SiC power systems

Infineon rolls out isolated gate drivers to support next wave of SiC power systems

February 12, 2026
0
ST launches Stellar P3E automotive MCU with on-chip AI acceleration for SDV platforms

ST launches Stellar P3E automotive MCU with on-chip AI acceleration for SDV platforms

February 11, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator