Today, Intel and Micron jointly announced that they will continue to cooperate in 3D Xpoint storage technology and will jointly develop second-generation of 3D Xpoint flash memory chips.

3D Xpoint is a non-volatile storage technology that offers extreme durability and low latency. The current commercial product is represented by Intel Optane. In fact, When Intel first announced 3D Xpoint storage, it claimed to be 1000 times faster than current SSD flash memory, 1000 times longer life and 10 times density, but the first generation is far from expectation.

It is reported that the second generation of 3D Xpoint will be completed in the first half of 2019, and the factory will be the IMFT (Intel-Micron Flash Technologies) factory in Lehi, Utah.

According to the data, 12 years ago, Intel and Micron established the joint venture IM Flash Technologies (IMFT), and the first products developed and produced are 72nm NAND. In 2012, Intel sold the shares of most IMFT factories to Micron, except the one in Lehi.

However, it should be noted that Intel and Micron have determined to independently develop third-generation or more advanced flash technologies after 2019. So, this should be the last collaboration between Intel and Micron on this technology.