SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › TSMC plans 3nm chip production in Japan, investment seen rising to $17 bln
  • 0

TSMC plans 3nm chip production in Japan, investment seen rising to $17 bln

SemiMediaEdit
February 9, 2026

February 9, 2026 /SemiMedia/ — TSMC is preparing to launch 3-nanometer chip production at its Kumamoto site in Japan, with total investment expected to rise to around $17 billion, according to a Japanese government source.

The move would give Japan its first domestic 3nm manufacturing capability, aimed at serving demand from AI data centers, autonomous driving systems and robotics.

TSMC had originally planned to produce 6nm to 12nm chips at its second Kumamoto fab, a project valued at about $12.2 billion. The revised plan upgrades the facility to advanced-node production, marking a shift toward higher-end logic chips.

A senior TSMC executive is expected to brief Japan’s prime minister on the project on Feb. 5, the source said. The government has backed the expansion as part of its broader push to strengthen supply security and rebuild local chipmaking capacity.

Japan currently has no commercial 3nm production. Officials said the project would not directly compete with Rapidus, which is developing 2nm technology in Hokkaido and targets mass production starting in fiscal 2027.

Tokyo has already approved subsidies of up to 732 billion yen for TSMC’s second Kumamoto plant in 2024. With the shift to 3nm, additional support is now under review.

Industry analysts said the expansion reinforces TSMC’s lead in advanced process technology while bringing Japan back into the high-end logic chip supply chain.

Related

3nm semiconductor production Advanced chip manufacturing AI data center chips Electronic components distributor electronic components news Japan semiconductor investment TSMC Japan fab
Omron issues price hike notice as automation and core components face cost pressure
Previous
TDK rolls out stackable µPOL modules targeting AI server and ASIC power delivery
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

TDK rolls out stackable µPOL modules targeting AI server and ASIC power delivery

TDK rolls out stackable µPOL modules targeting AI server and ASIC power delivery

February 9, 2026
0
Omron issues price hike notice as automation and core components face cost pressure

Omron issues price hike notice as automation and core components face cost pressure

February 9, 2026
0
Infineon to raise prices on power devices and ICs from April amid AI-driven demand

Infineon to raise prices on power devices and ICs from April amid AI-driven demand

February 6, 2026
0
SiTime to buy Renesas timing unit for $2.9 billion to expand AI data center reach

SiTime to buy Renesas timing unit for $2.9 billion to expand AI data center reach

February 6, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator