February 9, 2026 /SemiMedia/ — TDK has expanded its µPOL DC-DC power module lineup with the launch of the FS1525, a point-of-load converter designed to support high-current power delivery for AI servers, data centers and edge computing systems.

Each FS1525 module delivers up to 25A, while multiple units can be stacked or paralleled to reach a combined output of 200A. Unlike traditional board-level designs, the modules can be placed on the backside of the PCB directly beneath FPGAs, SoCs or ASICs, shortening power paths and improving efficiency in vertical power delivery layouts.

Built on TDK’s 3D chip-embedded packaging technology, the module integrates control, power stages, digital logic, memory and passive components into a compact footprint. The company said the thermal design allows stable operation under high ambient temperatures, making it suitable for dense server environments.

The FS1525 supports input voltages from 4.5V to 16V, with adjustable outputs between 0.6V and 1.8V, covering core rails for advanced 3nm to 6nm ASICs as well as SERDES supplies. Digital control via I²C and PMBus enables real-time monitoring of voltage, current and temperature, helping system designers manage fast-changing AI workloads.

TDK said the module has already been validated on platforms including AMD Versal, Altera Agilex and Zynq UltraScale+, which are widely used in AI acceleration, networking and data center infrastructure.

For more information, please visit https://product.tdk.com/en/search/power/switching-power/micro-pol/info?part_no=FS1525-0600-AL