July 17, 2025 /SemiMedia/ — Nexperia has expanded its discrete semiconductor portfolio with the release of 12 new MJD-style bipolar junction transistors (BJTs) in clip-bonded FlatPower (CFP15B) packages. Targeted at automotive and industrial power applications, the new MJPE series supports efficient thermal management and system miniaturization, responding to growing industry demand for space-saving, cost-efficient solutions.

The MJPE family includes six automotive-grade variants (e.g., MJPE31C-Q) and six industrial-grade types (e.g., MJPE44H11), offering VCEO ratings of 50 V, 80 V, and 100 V, and collector currents of 2 A, 3 A, and 8 A. Both NPN and PNP versions are available. Compared to traditional DPAK packages, CFP15B offers a 53% reduction in soldering footprint while maintaining thermal performance up to 175°C, crucial for high-density multilayer PCB systems.

These BJTs serve a wide range of power supply applications, including battery management systems (BMS), on-board chargers in electric vehicles (EVs), and backlighting in display panels. The clip-bonded structure of the CFP15B package not only boosts mechanical robustness but also enhances electrical and thermal efficiency, aligning with next-generation design requirements in the semiconductor industry.

“With the rise of multilayer PCB architectures, packaging has become central to thermal design,” said Frank Matschullat, Product Group Manager Power Bipolar Discretes at Nexperia. “Our CFP packaging delivers the same electrical performance in a smaller footprint, helping reduce both component and system-level costs. The MJPE series is part of our ongoing investment to support the increasing demand for CFP-based products in automotive and industrial markets.”

For more information on the MJPE BJT series, visit: www.nexperia.com/MJPE.