July 17, 2025 /SemiMedia/ — SK Keyfoundry has jointly developed an 8-inch Direct RDL (Redistribution Layer) packaging technology with LB Semicon, a semiconductor backend process specialist, and has completed reliability evaluations. The new wafer-level process targets high-current power semiconductors and automotive-grade applications.

Direct RDL builds metal wiring and insulating layers directly on the wafer, improving electrical connections and reducing signal interference. It is a key element in wafer-level packaging (WLP), enabling compact chip sizes and cost-effective integration. The jointly developed solution supports 15μm wiring thickness and achieves up to 70% die area coverage, allowing higher current capacity than competing solutions.

The technology complies with the AEC-Q100 Grade 1 automotive standard, ensuring operation in harsh conditions ranging from -40°C to 125°C. This makes it suitable for automotive, mobile, and industrial semiconductor use cases that require high reliability and performance.

To support customer adoption, SK Keyfoundry also offers process design kits and technical documentation, providing guidance on low-power, space-saving packaging with cost optimization.