SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Infineon is launching the new angle sensor
  • 0

Infineon is launching the new angle sensor

SemiMediaEdit
June 25, 2018

Infineon will hold the Sensor + Test 2018 Fair in Nuremberg from June 26th to 28th and will introduce the new XENSIV TM TLE5501 angle sensor series at the show.

Infineon is launching the new angle sensor-SemiMedia

It is understood that this product is a fast analog TMR angle sensor dedicated to automotive applications. The application area is wide ranging, from the steering angle with the highest functional safety requirements to wipers, pumps and actuators as well as motors. They are also suitable for industrial and consumer applications such as robotics or universal joints.

TMR technology provides high sensing sensitivity with high output voltage and can achieve up to 0.37 V / V output signal for all XENSIV TLE5501 products. Unlike other technologies, TMR-based sensors can be directly connected to the microcontroller without further amplification, saving customers cost. In addition, TMR shows very low temperature drift, reducing external calibration and compensation. In addition, TMR technology is known for its low current consumption, and the current consumption of the XENSIV TLE5501 series is as low as 2 mA.

The new sensor series will be available in two different qualification levels. TLE5501 E0001 is certified according to AEC Q100. This version is pin-compatible with the established Infineon TLE5009, but a cheaper system can be implemented because no additional amplifiers are required. Another version of the TLE5501 E0002 provides development in compliance with the ISO26262 standard and requires only one chip to implement the ASIL D level. It contains decoupled bridges for redundant external angle calculations and provides the highest diagnostic coverage required by functional safety regulations.

Infineon will begin mass production of the XENSIV TLE5501 series in August 2018.

Related

Infineon new angle sensor TLE5009
GUOXIN MICRO’s vice president resigned
Previous
Renesas Electronics introduces a new model development environment
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Renesas Launches RZ/G3L and RZ/G3SE 64-Bit MPUs With 1 mW-Class Standby Power

Renesas Launches RZ/G3L and RZ/G3SE 64-Bit MPUs With 1 mW-Class Standby Power

September 15, 2026
0
Microchip Launches SY757xx 1.2V Clock Buffers With Additive Jitter as Low as 26 fs

Microchip Launches SY757xx 1.2V Clock Buffers With Additive Jitter as Low as 26 fs

September 14, 2026
0
Vishay Launches XFD11KxxCA Bidirectional TVS With 11 kW-Class Pulse Capability and Up to 207.1 A Peak Current

Vishay Launches XFD11KxxCA Bidirectional TVS With 11 kW-Class Pulse Capability and Up to 207.1 A Peak Current

September 11, 2026
0
Infineon Launches TDA235E5 and TDA235E0 With 300 A Peak Current and Over 2 A/mm² Power Density

Infineon Launches TDA235E5 and TDA235E0 With 300 A Peak Current and Over 2 A/mm² Power Density

September 8, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator