According to reports, SK Hynix is selecting a site for its planned new advanced chip packaging factory in the United States. The new facility is expected to break ground in the first quarter of 2023, with mass production expected in 2025-2026.

In addition to building the new factory, SK hynix will build a nationwide network of R&D partners and facilities, and package its own memory chips and logic chips for machine learning and artificial intelligence applications designed by other American companies, the report said.

The report revealed that the estimated investment totaled several billions. However, SK Hynix did not disclose further details about the new factory, but sources said it was likely to be located near a university with ample engineering talent.