SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Onsemi announces world's first TOLL-packaged SiC MOSFET with 60% smaller packaging, enhanced performance and lower losses
  • 0

Onsemi announces world's first TOLL-packaged SiC MOSFET with 60% smaller packaging, enhanced performance and lower losses

SemiMediaEdit
May 11, 2022

onsemi recently announced the world’s first TO-Leadless (TOLL) packaged silicon carbide (SiC) MOSFET at TBL045N065SC1 which is intended for demanding applications including switch-mode power supplies (SMPS), server and telecommunication power supplies, solar inverters, uninterruptible power supplies (UPS) and energy storage. The device is suitable for designs that are required to meet the most challenging efficiency standards including ErP and 80 PLUS Titanium.

The NTBL045N065SC1 has a VDSS rating of 650 V with a typical RDS(on) of just 33 mΩ and a maximum drain current (ID) of 73 A. Based upon wide bandgap (WBG) SiC technology, the device has a maximum operating temperature of 175°C and ultra-low gate charge (QG(tot) = 105 nC) that significantly reduces switching losses. Additionally, the TOLL package is MSL 1 (moisture sensitivity level 1) rated – and guaranteed – to ensure that failure rates in mass production are reduced.

In addition, onsemi offers automotive grade devices with TO-247 3 lead, 4 leads and D2PAK 7 leads packages. For more information, please visit https://www.onsemi.com/products/discrete-power-modules/silicon-carbide-sic/silicon-carbide-sic-mosfets/ntbl045n065sc1.

Related

electronic components news NTBL045N065SC1 onsemi
ST and SEMIKRON collaborate to integrate silicon-carbide Power technology into next-generation electric vehicle drives
Previous
Onsemi Shenzhen is said to have sold two years capacity
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

AMD taps GlobalFoundries for MI500 photonics as it advances CPO design

AMD taps GlobalFoundries for MI500 photonics as it advances CPO design

April 22, 2026
0
Microchip launches CLB MCUs to improve timing control and cut system cost

Microchip launches CLB MCUs to improve timing control and cut system cost

April 22, 2026
0
EU to launch Chips Act 2.0 in May to speed funding and boost local ecosystem

EU to launch Chips Act 2.0 in May to speed funding and boost local ecosystem

April 22, 2026
0
Samsung targets May samples for HBM4E, eyes Nvidia AI demand

Samsung targets May samples for HBM4E, eyes Nvidia AI demand

April 21, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator