SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Renesas' production capacity is expected to return to pre-quake levels on March 23
  • 0

Renesas' production capacity is expected to return to pre-quake levels on March 23

SemiMediaEdit
March 22, 2022

Renesas Electronics issued an announcement on the 18th on the recovery of production at its three factories in Naka, Yonezawa and Takasaki after the earthquake.

Renesas Electronics pointed out that the Naka factory and the Takasaki factory have started production equipment from 17, and some test processes have resumed production on the same day. Production capacity at the Naka factory is expected to return to pre-earthquake levels on March 23.

In addition, the Yonezawa factory has resumed production of some test processes, and all processes resumed production on the 18th, and the production capacity has returned to the pre-earthquake level on March 20th.

In addition, Renesas pointed out that there was no personnel or major equipment damage.

Related

electronic components news Renesas
GlobalWafers says received orders from Infineon and ST for SiC substrates
Previous
Microchip release 3.3 kV SiC power devices, bringing efficiency and reliability to new levels
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Micron to build semiconductor SEZ in India under $1.6 billion investment plan

Micron to build semiconductor SEZ in India under $1.6 billion investment plan

June 12, 2025
0
Wolfspeed trims 73 jobs in North Carolina amid weak SiC chip demand

Wolfspeed trims 73 jobs in North Carolina amid weak SiC chip demand

June 12, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator