SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Renesas releases new power line communication modem IC enabling high-speed, long distance communication and expanding practical PLC applications
  • 0

Renesas releases new power line communication modem IC enabling high-speed, long distance communication and expanding practical PLC applications

SemiMediaEdit
December 6, 2021

Renesas Electronics recently introduced the R9A06G061 power line communication (PLC) modem IC. The R9A06G061 delivers high-speed communication at up to 1 Mbps over long distances of a kilometer or more, without the need for relays, expanding the range of practical applications for PLC. Optimized analog peripheral functions reduce the number of external components required, allowing for less expensive and more compact systems. With this combination, the new R9A06G061 is ideally suited for heating, ventilation, and air conditioning (HVAC) control, lighting system control in office buildings, and string monitoring and power conditioner control in solar power systems. Since it does not require the installation of dedicated cables, the R9A06G061 can enable low-cost system monitoring in applications such as monitoring of cellular antennas or motors in submersible pumps.

While Renesas’ current R9A06G037 PLC modem IC supports the G3-PLC, PRIME and Meters and More standards and can be used to implement large-scale multi-hop networks with a mesh topology, the new R9A06G061 is designed specifically for configuring simple peer-to-peer (P2P) networks with a bus or star topology. Improved transmission drive capability enables designers to increase the number of devices that can be connected twofold to more than 200 without the use of additional line drivers. In addition, the IC’s superior noise tolerance makes it suitable for a wide range of applications and environments.

“The cost and extended construction time associated with the installation of dedicated signal lines as well as the maintenance cost of additional devices are key issues for building and infrastructure device management,” said Toshihide Tsuboi, Vice President, Industrial Automation Business Division at Renesas. “PLC is an outstanding solution that overcomes these issues, and I am confident that our new product, designed specifically for P2P networks, will further broaden the scope of practical applications for PLC.”

 

Availability

The R9A06G061 ICs and evaluation kits are available now. More details can be found at www.renesas.com/R9A06G061.

Related

electronic components news R9A06G061 Renesas
SIA: Global semiconductor sales increased 24% year-to-year in October
Previous
TI introduces new precision broadband ADC, brings higher data acquisition performance while halving size and power consumption
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Infineon launches PSOC 4100T Plus MCU with integrated multi-sensing for HMI and control

Infineon launches PSOC 4100T Plus MCU with integrated multi-sensing for HMI and control

May 15, 2025
0
Murata to expand Vietnam plant to meet rising demand for automotive inductors

Murata to expand Vietnam plant to meet rising demand for automotive inductors

May 15, 2025
0
Samsung to outsource low-end photomasks to focus on advanced lithography

Samsung to outsource low-end photomasks to focus on advanced lithography

May 15, 2025
0
Top 10 OSAT vendors post modest growth in 2024 amid rising demand for advanced packaging

Top 10 OSAT vendors post modest growth in 2024 amid rising demand for advanced packaging

May 14, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator