Nexperia announced yesterday that more than 20 of its logic types in the company’s MicroPak package are now AEC-Q100 certified. These logic solutions are the smallest of the same type for automotive applications, and Nexperia’s Q100 portfolio exceeds the requirements of the Automotive Electronics Council.
Nexperia’s space-saving leadless MicroPak package saves up to 64% PCB space while providing a more reliable connection between the device and the board. The package covers a wide range of products including gates, analog switches, buffers/inverters/drivers, bus switches, converters, flip-flops, decoders/demultiplexers, multiplexers, latches, Level shifters and Schmitt trigger devices.
Nexperia’s automotive portfolio offers 20 XSON6 (SOT886 and SOT1202) and XSON8 (SOT833-1 and SOT1203) package solutions, including AUP (0.8 V to 3.6 V) low-power single-gate and dual-gate functions, AVC ( 1.2 V to 3.6 V) and LVC (1.65 V to 5.5 V) technology. In addition, more of the Nexperia’s MicroPak products can be released for automotive applications upon request.
For more information, please visit the Nexperia website: https://www.nexperia.com/products/logic/family/MICROPAK/